The aim is to investigate the challenges and potential solutions in metal sinter-joining for power electronics packaging.
Assessment of current metal sinter-joining techniques
Examination of applications in new energy vehicles and aerospace
Analysis of operating temperatures and current densities
Identified significant challenges in thermal management and material compatibility
Demonstrated the need for improved manufacturing processes
Revealed potential advancements in joining techniques for enhanced performance
Abstract
With the rapid development of emerging fields such as new energy vehicles, smart grids, and aerospace, the operating temperature and current density of power devices continue to increase, placing higher...