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February 12, 2026Advanced Materials3 citations

Multilevel Heterointerface Engineering Breaks the Trap‐Barrier Trade‐Off in High‐Energy‐Density Polymer Dielectrics

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YLYi LiuHarbin University of Science and TechnologyZSZhenjun ShaoMinistry of EducationJQJin QianTongji University

Key Points

  • The aim is to develop a strategy that enhances energy storage performance in polymer dielectrics through innovative interface engineering.
  • Integrated boron nitride and barium niobate nanosheets using lattice interlocking.
  • Created a complementary trap-barrier network for managing charge carriers.
  • Conducted first-principles calculations and finite element simulations to validate findings.
  • Achieved energy storage performance of 9.02 J cm −3 at room temperature with an efficiency of 92%.
  • Sustained 6.1 J cm −3 at 150°C with approximately 90% efficiency.
  • Preserved energy storage of 4.6 J cm −3 even at 200°C.

Abstract

ABSTRACT The low energy density, inefficient operation, and thermal instability of polymer dielectrics hinder the deployment of film capacitors under harsh environmental conditions. Interface engineering has emerged as a powerful strategy to introduce charge traps or construct interfacial barriers, thereby regulating carrier dynamics and enhancing energy storage. Here, we propose a multilevel heterointerface engineering strategy that integrates boron nitride and barium niobate nanosheets through lattice interlocking. The large work‐function offset and bandgap contrast induce interfacial band bending and a built‐in electric field, forming a complementary trap‐barrier network that guides, blocks, and confines charge carriers. This design effectively suppresses charge injection and mobility, enhances interfacial polarization, and mitigates the propagation of breakdown pathways. Consequently, BNO@BN/PEI composites achieve exceptional energy storage performance, delivering 9.02 J cm −3 ( η = 92%) at room temperature and sustaining 6.1 J cm −3 ( η ≈ 90%) at 150°C, while still preserving 4.6 J cm −3 at 200°C. First‐principles calculations and finite element simulations further validate the structural and functional superiority of the multilevel heterointerface. This work establishes multilevel heterointerface engineering as a generalizable paradigm for breaking the trap‐barrier trade‐off in conventional dielectric design and paves the way for next‐generation high‐energy‐density and thermally robust polymer capacitors.

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Cite This Study

Liu et al. (2026) studied this question.

synapsesocial.com/papers/698d6f0d5be6419ac0d55217https://doi.org/10.1002/adma.202517624
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