Thermal degradation of the interfacial microstructure critically limits the service life of Zn-Al brazed Cu/Al joints. This work elucidates the stabilizing role of trace Ni (0.3 wt.%) in retarding interfacial deterioration during 200 °C isothermal aging for up to 1000 h. Microstructural evolution and micromechanical responses were probed via SEM, EDS, and nanoindentation. In Ni-free joints, continuous Zn influx triggers the decomposition of the massive CuAl2 phase into a defect-ridden, Zn-rich lamellar structure, precipitating a sharp decline in shear strength from 57 MPa to 37.5 MPa. Conversely, Ni doping constructs a robust fine-grained interfacial architecture. The Ni-bearing coral-like layer exhibits exceptional morphological stability, while the underlying Cu-based transition layer undergoes in situ stratification and Zn ejection, functioning as a chemical buffer to intercept Zn diffusion. This microstructural reconfiguration enables Ni-doped joints to sustain a shear strength of ~55.2 MPa after 1000 h—matching the initial strength of Ni-free counterparts. The superior durability stems from the modulus softening of the stratified transition layer and a multi-stage crack deflection mechanism, offering a viable metallurgical strategy for robust Cu/Al interconnects.
Chen et al. (2026) studied this question.