High-Voltage 4H-SiC PiN Diodes: Ion Implantation vs. Epitaxial Growth for Wide-Temperature Operation

This study investigates the electrical performance of two 4H-SiC p+-i-n− diodes, based on lightly doped epitaxial layers, representative of high-voltage and neutron-detector structures. Each design was implemented in multiple nominally identical devices and characterized over the temperature range 298–623 K, with particular attention to the influence of p+ layer fabrication, n-type epitaxial layer thickness, and doping concentration. One diode features an ion-implanted p+ layer on a 250 µm thick n-type epitaxial layer, while the other employs an epitaxially grown p+ layer on a 100 µm thick n-type epitaxial layer. A comparison of reverse-bias Current–Voltage (I–V) and Capacitance–Voltage (C–V) characteristics indicates that, although both designs exhibit high-quality epitaxial 4H-SiC material, devices with an implanted p+ anode tend to show a more pronounced temperature-dependence and degradation of selected electrical parameters in reverse bias than those with an epitaxial p+ anode, while forward I–V in the range 298–623 K remains broadly similar for both designs. These observations suggest that anode fabrication and epitaxial design may jointly influence thermal stability, recombination mechanisms, and overall electrical performance, offering guidance for the optimization of 4H-SiC-based power and neutron-detector devices for high-temperature and harsh environments.