Elastocaloric cooling is an emerging solid-state refrigeration technology that leverages the latent heat exchange of shape memory alloys under mechanical stress. This study investigates the energy performance of a solid-to-solid elastocaloric cooling heat pump to enhance heat transfer efficiency and overall system performance. A Matlab-based numerical model, developed using the finite volume method, was employed to simulate the system. The energy performances of the elastocaloric heat pump are analyzed by varying the frequency of the cycle, the elastocaloric refrigerants, and the types of thermal diodes, from ideal up to realistic Peltier switches. The results demonstrate that the strategic use of thermal diodes significantly improves heat flow directionality, reducing thermal losses and enhancing the efficiency of the elastocaloric cooling process with a system that employs a realistic Peltier thermal diode, guaranteeing specific cooling powers up to 6500 W kg−1. The maximum COPs of the system with ideal thermal diodes range from 60 to 10. These findings contribute to the development of more efficient solid-state cooling technologies, offering a viable alternative to conventional systems, especially for electronic circuit cooling applications.
Cirillo et al. (2026) studied this question.