• MHD cooling of electronics in a baffled lid-driven cube is numerically investigated. • Electronic components are subjected to a constant heat flux condition. • THNF with an adiabatic baffle enhances the cooling of electronic components. This study numerically investigates the 3D magnetohydrodynamic convection cooling of electronic components exposed to a constant heat flux using a tri-hybrid nanofluid (THNFs) within a baffled lid-driven enclosure is investigated numerically using the finite volume method (FVM). The thermophysical properties of spherical tri-hybrid nanoparticles ( A l 2 O 3 , Cu , and MWCNT ) with a diameter of 10 nm are evaluated using the rule of mixture, Hamilton–Crosser, and Brinkman models. The key control parameters are the Reynolds number ( Re = 50 − 500 ) , Richardson number ( Ri = 0.01 − 10 ) , magnetic-field direction, Hartmann number ( Ha = 0 − 50 ) , volume fraction of the nanoparticles ( ϕ = 3 % ) , and baffle position (bottom, center, top). The key outcomes of this investigation are displayed in terms of streamline contours, temperature iso-surfaces, isotherms, velocity profiles, maximum dimensionless temperature, and heat transfer coefficient. The analysis indicates that the flow structure and heat transfer performance undergo substantial changes when transitioning between different thermal-convection regimes. The central baffle position yields optimal cooling efficiency. Furthermore, the application of the magnetic field reduces the thermal performance, whereas optimal thermal performance is achieved under zero-field conditions. This study concludes that THNF mixed convection is an effective technique for cooling electronic components and preventing overheating.
Doghmi et al. (2026) studied this question.