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March 15, 2026Journal of the Japan Society for Technology of Plasticity0 citationsOpen Access

Development of Incremental Diaphragm Forming Method

TYTakeshi YamadaKAKunihiko ABE

Key Points

  • The aim is to enhance the quality of products produced through incremental forming by reducing thickness loss and surface imperfections.
  • Developed an incremental diaphragm forming method using a hemispherical shape and SPCC diaphragm.
  • Conducted experiments with 0.81 mm thick Al alloy 2024-T3 and 1 mm SPCC diaphragm.
  • Analyzed forming limits and thickness reduction using standard and diaphragm methods.
  • Forming limits improved from 45° in conventional forming to 50° with diaphragm method.
  • Thickness reduction was limited to 5%, with slight increases beyond 40° suggesting thinning suppression.
  • Eliminated tool marks and maintained comparable surface roughness to conventional methods.

Abstract

Incremental forming is suitable for the low-volume production of various products and has potential aerospace applications. However, it causes significant plate thinning due to its ironing and leaves tool marks. To address this, we developed an incremental diaphragm forming method using a hemispherical shape and a Steel Plate Cold Commercial (SPCC) diaphragm. This approach suppressed thickness reduction and tool mark formation effectively. Experiments using the 0.81 mm thick Al alloy 2024-T3 showed forming limits around 45° in conventional incremental forming, whereas using a 1 mm SPCC diaphragm extended forming to 50°, despite some wrinkling. Thickness reduction was kept within 5%, and thickness slightly increased beyond 40°, suggesting thinning suppression through drawing. Tool marks were eliminated by diaphragm surface transfer, and surface roughness remained comparable to that attained by conventional incremental forming, demonstrating the method’s effectiveness in improving workpiece quality.

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Cite This Study

Yamada et al. (2026) studied this question.

synapsesocial.com/papers/69b64d48b42794e3e660e08fhttps://doi.org/10.9773/sosei.251001
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