Reliability Evaluation of Packaging Structures Using Thermo-Mechanical-Electromagnetic Coupled Analysis

In recent years, the interplay of thermal, mechanical stress, and electromagnetic fields in electronic devices and semiconductor packaging has highlighted the growing need for Multiphysics Coupled Analysis (MPA) in integrated evaluations.Traditionally, these fields were analyzed separately using single-physics simulations, but early-stage development often led to missed conditions and repeated analysis, limiting design accuracy.MPA began around 2000 with unidirectional data linkage—electromagnetic to thermal to stress analysis. In the 2010s, GUI-based platforms enabled bidirectional coupling, allowing mutual interactions between physical domains to be considered.Since the 2020s, MPA has become a standard early-stage design tool, enhanced by cloud computing and AI, supporting complex packaging and next-gen high-speed communications.This paper reviews the background of MPA, recent applications, and advances in simulation methods and technologies.