PulseExploreJournal ClubDebatesTrendingResearchersJournals
Instagram
HomeExploreJournal ClubTrending
Synapse
⌘+K
Synapse
June 6, 2016IEEE/ASME Transactions on Mechatronics101 citationsOpen Access

Frequency-Domain ILC Approach for Repeating and Varying Tasks: With Application to Semiconductor Bonding Equipment

View Full Paper
FBFrank BoerenABAbhishek BarejaTKTom Kok

Key Points

Key points are not available for this paper at this time.

Abstract

Iterative learning control (ILC) enables high performance for exactly repeating tasks in motion systems. Besides such tasks, many motion systems also exhibit varying tasks. In such cases, ILC algorithms are known to deteriorate performance. An example is given by bonding equipment in semiconductor assembly processes, which contains motion axes with tasks that can vary slightly. The aim of this paper is to develop an ILC approach that obtains high machine performance for possibly varying tasks, while enabling straightforward and effective industrial design rules. In particular, a frequency-domain-based design of ILC filters is pursued, which is combined with basis functions to cope with variations in tasks. Application to a high-speed axis of an industrial wire bonder shows that high servo performance is obtained for both repeating and varying tasks.

Ask AI
Helpful
Bookmark
Share
View Full Paper

Cite This Study

Boeren et al. (2016) studied this question.

synapsesocial.com/papers/6a050e90d62d995da03446a8https://doi.org/10.1109/tmech.2016.2577139
Ask AI
Helpful
Bookmark
Share
View Full Paper

Also Consider

Synapse has enriched 5 closely related papers on similar clinical questions. Consider them for comparative context:

  1. 1Unified ILC framework for repeating and varying tasks: A frequency domain approach with application to a wire-bonder2015 · 6 citations
  2. 2Wire Bonding in Microelectronics2011 · 343 citations
  3. 3Dynamics of an ultrasonic transducer used for wire bonding1998 · 41 citations
  4. 4An Iterative-Based Feedforward-Feedback Control Approach to High-Speed Atomic Force Microscope Imaging2009 · 29 citations
  5. 5Wire bonding in microelectronics2010 · 226 citations