In this paper, the fatigue life of the chip array resistors depended on the solder height are analyzed by using finite element analysis methods. Through making different solder volume, four heights of universal solders were discovered. Also three-dimensional structural model was made. The characteristics of the stress in chip array resistors under the several thermal cycle conditions were simulated. Through this, thermal stress characteristics of chip resistor were analyzed. As a result every junction part is affected by temperature more than other parts of the chip resistor.
Kang et al. (2026) studied this question.