Abstract The integration of printed electronics into injection-moulded polymer parts has emerged as a promising route for the development of lightweight, conformable, and multifunctional products. By combining printed circuitry with thermoforming and injection moulding processes, In-Mould Electronics (IME) enables the integration of aesthetic and functional features within structurally efficient polymer components. This review provides a process-oriented analysis of IME technology, covering printed electronics materials, substrate systems, fabrication techniques, sustainability considerations, and the industrial challenges associated with large-scale implementation. Particular attention is given to numerical simulation, including thermoforming and injection moulding analyses using tools such as Moldex3D and Autodesk Moldflow Insight, and their role in process optimisation, defect prediction, and reliability improvement. The review highlights that IME performance is governed by strong interactions between materials, deformation behaviour, interfacial adhesion, and processing conditions. The main barriers to broader adoption include material compatibility, process complexity, limited long-term reliability data, and the absence of dedicated standards and qualification procedures. Future research should therefore focus on integrated material–process optimisation, advanced multiphysics simulation, recyclability, and robust validation strategies to support the industrialisation of IME.
Vasafi et al. (2026) studied this question.