Reduction of interface-state density in 4H–SiC n-type metal–oxide–semiconductor structures using high-temperature hydrogen annealing

The effects of hydrogen annealing on capacitance–voltage (C–V) characteristics and interface-state density (Dit) of 4H–SiC metal–oxide–semiconductor (MOS) structures have been investigated. The Dit was reduced to as low as 1×1011 eV−1 cm−2 at Ec−E=0.6 eV using hydrogen annealing above 800 °C, where Ec−E is the energy level from the conduction-band edge. Secondary ion mass spectroscopy and Dit analysis revealed that Dit decreased with the increase of hydrogen concentration accumulated at the SiO2/4H–SiC interface. The interface states at SiO2/4H–SiC are thought to be originated from the dangling bonds of C atoms as well as Si atoms, because Dit decreases as the hydrogen annealing temperature increases and saturates around 800 °C. This high-temperature hydrogen annealing is useful for accumulation-type SiC metal–oxide–semiconductor field-effect transistors, which have n-type MOS structures to reduce the Dit.