首页
探索
nav.journalClub
趋势
更多
Synapse
⌘+K
Synapse
语言
简体中文
简体中文
Michael Pecht | Synapse
MP
Michael Pecht
Electronic Packaging and Soldering Technologies
Life Cycle Engineering (United States)
Share
Follow
Claim This Profile
About
Research focus
Electronic Packaging and Soldering Technologies
Impact
1,567 pubs · 50,170 cites · h-index 102
Affiliations
Life Cycle Engineering (United States)
University of Maryland, College Park
Hong Kong Polytechnic University
See all
Publications