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Hiroshi Nishikawa | Synapse
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Hiroshi Nishikawa
Electronic Packaging and Soldering Technologies
The University of Osaka
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About
Research focus
Electronic Packaging and Soldering Technologies
Impact
879 pubs · 12,632 cites · h-index 55
Affiliations
The University of Osaka
Fujitsu (Japan)
Osaka Research Institute of Industrial Science and Technology
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