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John H. Lau | Synapse
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John H. Lau
Electronic Packaging and Soldering Technologies
Micron Corporation (United States)
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About
Research focus
Electronic Packaging and Soldering Technologies
Impact
580 pubs · 13,797 cites · h-index 55
Affiliations
Micron Corporation (United States)
Nanya Technology (Taiwan)
East Asia School of Theology
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