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Abstract In response to the increasing demand for enhanced computational capabilities within satellite systems, there has been a simultaneous rise in the heat flux density of onboard electronic components. The thermal output of these components has significantly increased compared to traditional satellite processing electronics, leading to a concurrent elevation in the heat flux density related to processing chips and the surfaces accommodating equipment installations. This paper establishes a model for conduction heat dissipation in aviation electronic products. The outlined calculation methodology facilitates a preliminary assessment of the system’s heat dissipation capacity. The article further examines the inherent heat dissipation capabilities in two commonly employed structural configurations. Additionally, it introduces an integrated design approach for structural heat dissipation, including experimental considerations and validation outcomes. The assessment methodologies and design principles detailed in this article are particularly relevant and applicable to the thermal design imperatives associated with high-power electronic products deployed for the extended operational durations typical of spacecraft.
Wang et al. (Wed,) studied this question.