Abstract The rising thermal load in modern microelectronic devices necessitates compact cooling solutions with improved heat removal capability. This work examines the thermo-hydraulic performance of straight and secondary-wavy microchannels (SWMC), additively manufactured in AlSi10Mg using Direct Metal Laser Sintering (DMLS). Experiments were conducted under heat fluxes of 20–40 W/cm 2 , and the flow rates of 100–475 ml/min (Re = 25–123) using a water-ethylene glycol base fluid and Al 2 O 3 /CuO nanofluids at 0.02 and 0.05% concentrations. The nanofluids enhanced convective performance, yielding up to 12.35% improvement in straight channels and 16.97% in SWMC at 30 W/cm 2 and Re = 123, with the wavy geometry consistently offering superior heat transfer due to curvature-induced secondary flows. In parallel, five machine-learning models were developed to predict wall temperature and Nusselt number; among them, the Gradient Boosting model provided the closest agreement with experimental data. The findings highlight how additively manufactured microchannel geometries, nanoparticle-enhanced coolants, and data-driven predictive tools can be jointly leveraged to advance thermal management in high-power electronic applications.
Vijetha et al. (Fri,) studied this question.