Automotive optical sensors are essential in enabling advanced driver-assistance systems (ADAS), which significantly enhance vehicle safety and push the boundaries of autonomous driving technology. By accurately detecting and interpreting the environment, these sensors allow ADAS to respond to various driving conditions, reducing the risk of accidents. As the demand for safer and more efficient vehicles grows, these sensors will continue to play a key role in advancing the capabilities of autonomous driving systems. Additionally, automotive optical sensors are migrating to advanced wafer nodes and integrating control unit elements to support the sophisticated functionalities and applications demanded by the increasingly complex automotive market. The new trend requires more advance packaging technologies, Heterogenous Integration (HI) and standard platforms. This evolution poses significant challenges in assembly, testing, and meeting stringent reliability standards. Amkor Technology has proactively addressed these challenges through innovative approaches in automotive optical packaging. Leveraging extensive experience in automotive applications and diverse packaging solutions, a robust package platform has been developed explicitly tailored for optical sensors. This platform uses an adaptable assembly toolbox and integrates advancements in extending existing technology to streamline development cycles while optimizing packaging characteristics. This presentation will delve into Amkor’s standardized package platform, showcasing its versatile design solutions for optical sensors. It will explore how these solutions effectively navigate technical obstacles, adhere to Automotive Electronics Council (AEC-Q100) reliability standards, and drive forward the evolution of ADAS and autonomous driving technologies. These advancements in automotive optical sensor packaging will continue ensure enhanced performance and safety across the automotive landscape.
Lu et al. (Tue,) studied this question.