Molecular dynamics unveils compatibility between aromatic ester-based liquid crystalline epoxy and diamine curing agent for enhanced intrinsic thermal conductivity

Key Points

• Enhanced thermal conductivity is achieved using a compatible aromatic ester-based liquid crystalline epoxy and diamine curing agent.
• The study identifies compatibility through molecular dynamics simulations, showing improved interactions between the components.
• Observational analysis leveraging molecular dynamics provides insights into material interactions not seen with traditional methods.
• Molecular dynamics confirms potential applications in advanced materials; however, additional studies are essential for real-world applicability.