DIC-based J-integral quantification for through-thickness crack in CHS joints

Key Points

• Crack propagation is quantified using the J-integral method, revealing significant insights into structural integrity.
• The J-integral approach shows accurate readings of crack behavior under stress conditions in CHS joints.
• Analysis incorporates digital image correlation (DIC) to enhance measurement accuracy in structural assessments.
• Findings support the need for improved methods in analyzing through-thickness crack issues, particularly in CHS applications.