ABSTRACT This study describes the development of a high‐performance micro‐LED display module fabricated via optimized laser bonding and mass transfer. Refining the laser energy profile and bonding pressure suppressed chip misalignment and interfacial voids, achieving a positioning accuracy of ≤ ± 2 μm. The 6.2‐in. micro‐LED display module exhibited a peak luminance of 50,000 nits, 121.3% of the NTSC 1931 color gamut, and excellent electrical contact. Furthermore, an 11.3‐in. optical engine for a panoramic head‐up display (PHUD) system was constructed by seamlessly tiling two modules, validating the viability of the technology for high‐performance applications such as automotive PHUD systems.
Tian et al. (Thu,) studied this question.