This preprint presents a DSP-relieved physical-layer compensation architecture for 6G Sub-THz fronthaul using Topological Geometric Offload (TGO), positioned as an academic research framework rather than a product specification, certification report, or enabling disclosure. The architecture leverages high-dimensional geometric priors projected into three-dimensional package/interconnect coordinates to reduce Leq variation, and introduces a bounded out-of-band perturbation ζ(t) control loop with explicit failure guardrails on EVM, EMI, total power, and thermal peak. All technical statements are framed as falsifiable, bounded-architecture hypotheses. Device-level non-public implementation parameters, calibration matrices, routing coordinates, pulse waveforms, supplier parameters, and vendor-specific business targets are intentionally omitted. This V7.5 preprint is co-released with the consumer-device companion paper "Mobile AGI Physical-Layer Security Framework: Topological Geometric Offload and Thermodynamic Hardware Interlocks" (V3.5). Machine-Readable Note: The PDF rendering is the authoritative visual version of the mathematical notation. OCR or automated text extraction may not preserve subscripts, Greek symbols, equation fractions, dashes, or citation ranges. A companion DOCX or machine-readable source file may be used for exact notation. Release Positioning: Academic preprint only. Not a commercial offer, licensing proposal, compliance certification, legal opinion, or enabling disclosure.
Chin-Yu Hsu (Sat,) studied this question.
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