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Requirements for infrared focal plane arrays (IRFPAs) for advanced infrared imaging systems are discussed, and an overview is given of different IRFPA architectures. Important IR detector structures, including photoconductive, photovoltaic, metal-insulator-semiconductor (MIS), and Schottky barrier, are reviewed. Infrared detector materials and related crystal-growth techniques are discussed, emphasizing applicability to IRFPA designs and performance. Three types of input circuit used to couple the detector to the readout circuitry are discussed, namely, direct injection, buffered direct injection, and gate modulation. An overview is given of several readout techniques, including the CCD, MOSFET switch, CID, and CIM. Also discussed are related onchip signal processing topics as well as questions regarding producibility and array implementation.>
Scribner et al. (Tue,) studied this question.