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We present a set of design tools for 3-D Integration. Using these tools - a 3-D standard-cell placement tool, global routing tool, and layout editor - we have targeted existing standard-cell circuit netlists for fabrication using wafer bonding. We have analyzed the performance of several circuits using these tools and find that 3-D integration provides significant benefits. For example, relative to single-die placement, we observe on average 28% to 51% reduction in total wire length.
Das et al. (Wed,) studied this question.