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In the present work, three near-eutectic lead-free solder melts of Sn-8wt.%Zn; Sn-8wt.%Zn-2wt.%Bi and Sn-8wt.%Zn-4wt.%Bi have swiftly solidified by means of the melt-spinning technique for intermediate –step soldering. The thermal and various mechanical properties of the formed melt-spun ribbons were investigated by dynamic resonance technique, Vickers micro-hardness test under annealing temperatures in the range from 348 K to 448 K. Thermal analysis using differential thermal analysis (DTA) technique revealed a decrease in melting point and solidus point with %Bi. Wettability property was determined by evaluating the contact angle on a different substrate and found to be in the range 31° to 43° on Cu or CuZn30 substrates and in the range from 110° to 115° on Al substrate. The microhardness tests as a function of temperature were performed to determine the stiffness of Sn-Zn solder alloys. Isothermal creep curves for the synthesized samples alloys were determined and plotted under constant applied stresses at a constant temperature of 463 K. Microstructure of the as-cast alloys both, at room temperature and annealed at 348 K were recorded. The creep test on the structure change and properties of Sn–Zn alloys were reported with the effect of the cold work deformation. The Sn-8wt.%Zn-4wt.%Bi is a candidate material for solder which is free of Pb and widely used for packaging of micromechanical systems as a hermetic sealing step.
Negm et al. (Thu,) studied this question.