Inicio
Explorar
nav.journalClub
Tendencias
Más
synapse
⌘+K
Idioma
Español
Español
Thermal-Ultrasonic stress relief and microstructural evolution | Synapse
March 3, 2026
Thermal-Ultrasonic stress relief and microstructural evolution
YF
Yuxin Fang
ZW
Zhaocheng Wei
QY
Quanwei Yang
Ver todo
Puntos clave
Microstructural evolution influences material properties significantly, enhancing mechanical behavior.
Thermal stress methods assessed alongside ultrasonic techniques led to notable changes in microstructural characteristics.
Analysis of thermal-ultrasonic stress relief methods showed improved outcomes in material durability and resilience under various conditions.
The findings support the use of combined thermal and ultrasonic approaches; additional validation is needed for diverse materials.
Mark Helpful
Me gusta
Save
Guardar
Relay
Compartir
Mark Helpful
Me gusta
Save
Guardar
Relay
Compartir
Cite This Study
Copy
Fang et al. (Wed,) studied this question.
synapsesocial.com/papers/69a76034c6e9836116a2cb5b
https://doi.org/https://doi.org/10.1016/j.ijmecsci.2026.111349