Micro-Channel Cooling of Hot Spots Through Nonuniform Aspect Ratio Designs

Abstract Electronic devices experience spatial variation in power dissipation, which results in high-temperature hot spots. These locations require aggressive thermal management, which can be complex and costly. Simple solutions such as single-phase microchannels can provide adequate heat transfer, but they are not designed to control heat transfer locally. However, microchannels can be tailored to control local flowrates and heat transfer, potentially mitigating hot spot temperatures. Using a conductive and convective resistance network for a micro-channel, an analytical model is generated for heat transfer within an individual passage. For a given channel width, this model relates the channel depth to its resistance through a power law. Over a wide range of heat fluxes, the optimal design balances local temperatures to within 3 K. The analytical model is validated using computational simulations of the optimized heat sink. For a randomly generated, nonuniform power distribution, device temperatures are balanced with a sample standard deviation below 2.5%, which is significantly better than a baseline design. When heat spreading is incorporated, the temperature increase is smaller but remains uniform, indicating that the hot spots can be mitigated.