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Abstract This article studies the influence of electrode material on tin (Sn) electrodeposition from deep eutectic solvent. The Sn electrodeposition from ethaline‐based electrolyte onto glassy carbon (GC) and Pt substrates has been studied using cyclic voltammetry and chronoamperometry. The patterns and parameters of Sn nucleation and growth processes have been determined by means of Scharifker and Hills and Scharifker–Mostany models. Results show that Sn nucleation onto GCE follows instantaneous 3D nucleation, while in the case of PtE, it is controlled by adsorption, instantaneous 3D nucleation, and residual water reduction. The growth mechanism is diffusion‐controlled for both electrodes. The parameters of Sn electrodeposition onto GCE and PtE such as diffusion coefficient ( D ), nucleation rate ( A ), and active site density of Sn nuclei ( N o ) are evaluated. The results showed that A and N o increase linearly as the deposition potential is displaced towards more electronegative values while D is almost unchanged, regardless of the involved working electrode. The morphology and the structure of the electrodeposited Sn are also discussed based on scanning electron microscopy, X‐ray diffraction, and energy‐dispersive X‐ray spectroscopy investigations.
Phuong et al. (Wed,) studied this question.