Study on the adsorption loss of gold during copper precipitation in the hydrometallurgical processing of waste printed circuit boards

Key Points

• Gold adsorption loss occurs during copper precipitation processes, impacting recovery efforts.
• Up to 40% of gold can be adsorbed when processing waste printed circuit boards, limiting its availability.
• Assessment based on experimental data from waste printed circuit boards shows consistent patterns of gold loss.
• Understanding these losses calls for improving recovery methods in hydrometallurgical processes to enhance gold yield.