Experimental study on the influencing factors of short-circuit characteristics of press-pack IGBTs

Key Points

• Short-circuit characteristics are significantly influenced by thermal performance and voltage stress during operation.
• Key evidence shows that specific failure modes alter the reliability of press-pack IGBTs under short-circuit conditions.
• The observational analysis examines multiple influencing factors affecting the performance of press-pack IGBTs across various scenarios.
• Highlights the need for improved designs and testing to enhance the reliability of press-pack IGBTs under extreme conditions.