Lunar dust challenges the successful operation of future lunar missions by threatening astronaut safety and degrading mission hardware. Among various dust mitigation strategies, Electrodynamic Dust Shields (EDS) have emerged as a leading active solution. Current implementations still fall short under realistic lunar conditions, particularly in terms of mechanical flexibility, durability, and performance. This paper evaluates two flexible EDS systems: copper electrodes on polyimide with a dielectric coating, and a novel class featuring chemically modified reduced graphene oxide (CMrGO) electrodes on translucent polymeric substrates. Copper-based devices provide a cost-effective, rapidly manufacturable baseline that enables experimental validation of optimized electrode geometries, but are known to suffer from cracking under repeated bending. CMrGO devices offer greater mechanical durability, though their optimization remains constrained by fabrication limits. The dust removal effectiveness of spiral and interdigitated electrode patterns in two-phase and three-phase configurations is tested under high vacuum and ultraviolet light exposure, mimicking lunar surface charging conditions. Results show that copper–polyimide EDS with an optimized electrode geometry achieve over 90% dust removal efficiency when operated at applied voltages above 3 kV, compared to 70% for non-optimized designs operated at 6 kV. CMrGO-based shields reach 60% efficiency when operated at 1.8 kV but are limited by the occurrence of micro-discharges caused by the absence of dielectric coatings. However, when tested with continuous dust fall instead of with an already covered surface, CMrGO-based devices achieve near-complete dust removal, comparable to that of copper-based devices under the same conditions. Simulations and experimental results demonstrate that a moderate curvature of flexible substrates has a minimal impact on the performance of the shields. • Flexible EDS devices are needed for advanced lunar systems but suffer from low TRL. • Copper–based EDS enable rapid prototyping and allow geometry optimization. • CMrGO-based EDS enhance mechanical durability but are limited by microdischarges. • CMrGO EDS achieve 60% removal when dust-covered and > 90% under dynamic dusting. • Optimized copper–based EDS achieve > 90% dust removal in both test modes.
Pacelli et al. (Sat,) studied this question.