Rigid-flexible active ester resin of hybridizing organosilicone-biphenyl-naphthalene with robust strength, low-dielectric, and low-hygroscopic epoxy thermosets toward electronics packaging

Key Points

• The novel active ester resin demonstrates low-dielectric properties, enhancing its potential for electronics.
• Specifically, this resin hybridizes organosilicone and biphenyl with naphthalene to improve mechanical strength.
• Assessment with various materials indicates promising characteristics suitable for advanced electronics packaging applications.
• Further testing is needed to fully determine the long-term performance in real-world electronic settings.