Rigid-flexible active ester resin of hybridizing organosilicone-biphenyl-naphthalene with robust strength, low-dielectric, and low-hygroscopic epoxy thermosets toward electronics packaging
Key Points
The novel active ester resin demonstrates low-dielectric properties, enhancing its potential for electronics.
Specifically, this resin hybridizes organosilicone and biphenyl with naphthalene to improve mechanical strength.
Assessment with various materials indicates promising characteristics suitable for advanced electronics packaging applications.
Further testing is needed to fully determine the long-term performance in real-world electronic settings.
Rigid-flexible active ester resin of hybridizing organosilicone-biphenyl-naphthalene with robust strength, low-dielectric, and low-hygroscopic epoxy thermosets toward electronics packaging | Synapse