Accueil
Explorer
nav.journalClub
Tendances
Plus
synapse
⌘+K
Langue
Français
Research Paper | Synapse
March 3, 2026
Passive two-phase immersion cooling achieving over 1000 W per chip via porous coated flat plate heat pipes
JL
Junzhao Lu
University of Chinese Academy of Sciences
YM
Yu Ma
Guangzhou Center for Disease Control and Prevention
HZ
Haojie Zhou
University of Chinese Academy of Sciences
See all
Key Points
Over 1000 W per chip was achieved with passive two-phase immersion cooling and flat plate heat pipes.
The thermal management performance highlights significant advancements in cooling technology for electronic components.
Analysis of the cooling system utilized porous coated heat pipes for optimal heat transfer efficiency.
These findings suggest potential for enhanced heat dissipation in high-performance computing applications.
Mark Helpful
Like
Save
Bookmark
Relay
Share
Mark Helpful
Like
Save
Bookmark
Relay
Share
Cite This Study
Copy
Lu et al. (Tue,) studied this question.
synapsesocial.com/papers/69a761bdc6e9836116a2fcbe
https://doi.org/https://doi.org/10.1016/j.enconman.2026.121237