Polystyrene has been widely used as packaging materials for household appliances due to its lightweight and low cost. However, environmental considerations have led to a shift towards cardboard, which has a higher recycling rate and lower energy consumption and CO2 emissions during production. Cardboard has lower shock absorption compared to polystyrene, necessitating innovative designs for packaging containers with excellent cushioning properties. Therefore, numerical simulations using the mechanical properties of the liner and core, which are the components of cardboard, have been attempted in the past. However, challenges remain in replicating the impact of product packaging during drops with high accuracy. This study proposes modeling techniques that consider shape effects and delamination phenomena of cardboard in addition to the mechanical properties. We report on simulation techniques applied to compression tests.
Ohata et al. (Wed,) studied this question.