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Physics-Based Reliability Analysis of Power Modules at Substrate and Component Level | Synapse

March 29, 20261 citations

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Physics-Based Reliability Analysis of Power Modules at Substrate and Component Level

AMAnu MathewFraunhofer Institute for Electronic Nano Systems SRSusana Richter-TrummerFraunhofer Institute for Electronic Nano Systems JAJan AlbrechtFraunhofer Institute for Electronic Nano Systems

Key Points

The aim is to evaluate the reliability of power modules by examining both substrate and component levels under various conditions.
Conducted a physics-based reliability analysis
Assessed failure modes at substrate and component levels
Utilized advanced simulation techniques
Identified critical failure modes impacting reliability
Quantified the effects of substrate and component interactions
Highlighted potential areas for design improvement

Abstract

222

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Cite This Study

Mathew et al. (Wed,) studied this question.

synapsesocial.com/papers/69c8c0b0de0f0f753b39b809 https://doi.org/https://doi.org/10.30420/566541028

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