Dynamic recrystallization processes are known to significantly affect both the mechanical properties and the microstructure of materials. In this paper, we investigate the influence of discontinuous dynamic recrystallization (dDRX) during deformation at high strain rates (from 104 to 105 s−1) and elevated temperatures in pure aluminum and copper (in the range of 700–800 K for aluminum and 800–1100 K for copper). For this purpose, we propose a theoretical model in which the material is described within the framework of continuum mechanics, plastic deformations are modeled using a dislocation plasticity approach, the equation of state is represented by a neural network, and the microstructure evolution is simulated using the cellular automata method. The model is applied to uniaxial compression and tension of copper and aluminum polycrystals with an initial average grain size of 14 μm. It is shown that grain refinement occurs in all systems. The average grain size decreases from 14 μm to 4–5 μm. The distribution of plastic and total strains in the polycrystals is presented. In all considered systems, deformation localization is observed, and the localization pattern changes due to the nucleation of new grains and grain boundary surfaces during dynamic recrystallization.
Fomin et al. (Thu,) studied this question.