Indium Corporation (United States)

Recent papers from Indium Corporation (United States)

1. Novel Interconnect Materials for Advanced Packaging Assembly ProcessesIMAPSource Proceedings · 2026
2. Augmenting ICP-OES Sensitivity for Trace Element Analysis in Crude Oil via High-Efficiency Micro-Ultrasonic NebulizationAnalytical Chemistry · 2026
3. MultifunctionalGreen Depressant for Selective CalciteDepression in Cassiterite Flotation: Interfacial Adsorption and HydrationMechanismLangmuir · 2026
4. Examining Formic Acid Reflow in Power Device Packaging for Flux-Free SolderingIMAPSource Proceedings · 2026
5. Impact on Reliability of Microvoids and β -Sn Anisotropy in Flip-Chip BumpsIEEE Transactions on Components Packaging and Manufacturing Technology · 2025
6. Comparison of Electromigration in Tin-Bismuth Planar and Bottom Terminated Component Solder JointsJournal of Surface Mount Technology · 2024
7. Electromigration in Eutectic Tin-Bismuth Bottom-Terminated-Component Solder Joints2024
8. Thermal Performance and Reliability of Liquid Metal Alloys as Thermal Interface Materials for Computing Electronics Devices2024
9. The Challenges of High-Temperature Lead-Free Solder Paste for Power Discrete Applications2024
10. Comparing Electromigration in Tin-Bismuth Alloys using planar geometry solder joints2024
11. Optimizing Type 7 Solder Paster Formulation and Compatibility with Assembly Technology for Sub-75um System-in-Package ApplicationsIMAPSource Proceedings · 2024
12. Thermal Performance and Reliability of Liquid Metal Pastes with Solid Metal Particles as Thermal Interface Materials for the Cooling of Computing ElectronicsIMAPSource Proceedings · 2024
13. A Jettable and Dispensable Liquid Metal Paste as a Thermal Interface MaterialIMAPSource Proceedings · 2024
14. Electromigration in Tin-bismuth Planar Solder JointsTransactions of The Japan Institute of Electronics Packaging · 2024
15. An insight into embryogenesis interruption by carbon nitride dots: can they be nucleobase analogs?Nanoscale · 2022
16. Anisotropic constitutive model coupled with damage for Sn-rich solder: Application to SnAgCuSb solder under tensile conditionsInternational Journal of Damage Mechanics · 2021
17. Mechanical Performance and Reliability of a Sn–Ag–Cu–Sb Alloy at Elevated TemperaturesIEEE Transactions on Components Packaging and Manufacturing Technology · 2021
18. Curaxin CBL0137 has the potential to reverse HIV‐1 latencyJournal of Medical Virology · 2019
19. Reliability of Fan-Out Wafer-Level Heterogeneous IntegrationJournal of Microelectronics and Electronic Packaging · 2018
20. Design, Materials, Process, and Fabrication of Fan-Out Panel-Level Heterogeneous IntegrationJournal of Microelectronics and Electronic Packaging · 2018