AT&S (Austria)

Recent papers from AT&S (Austria)

1. Viscosity prediction of an epoxy prepreg resin using a three-regime model incorporating isoconversional state diagramsJournal of Rheology · 2026
2. Super-Gaussian surface characterization and predictive geometry modeling for femtosecond laser micromachining in epoxy compositesOptics & Laser Technology · 2026
3. Femtosecond laser drilling of epoxy composites: a review of mechanisms, modeling, and adaptive controlThe International Journal of Advanced Manufacturing Technology · 2025
4. Application of machine learning modeling for predicting the reliability of solder joints under thermal cyclingMicroelectronics Reliability · 2025
5. Embedded component packaging for D-band radio systems2024
6. Enthalpy‐Driven Self‐Healing in Thin Metallic Films on Flexible SubstratesAdvanced Materials · 2024
7. A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies2024
8. Investigation of the effects of moisture expansion of glass fiber reinforced epoxy resins on printed circuit boards using digital image correlation2024
9. Life-time prediction of copper µ-vias based on a stochastic design variation approach2024
10. Exploring the Impact of Laser Drilling on Material Thermal Decomposition: A Computational Study Using KratosMultiphysics2024
11. Investigating the Impact of Final Finishes on the Insertion Loss in As Received and After AgingIMAPSource Proceedings · 2024
12. Consistent and Cost-Effective PCB-Based D-Band Air-Filled Substrate-Integrated-Waveguide Filters2024
13. Experimental analysis of grounded coplanar waveguide structures based on different PCB processes with uncertainty analysisIEICE Electronics Express · 2023
14. Air-filled SIW technology for mass-manufacturable and energy-efficient terahertz systemsScientific Reports · 2023
15. D-Band Air-Filled Substrate Integrated Waveguide (AFSIW) and Broadband Stripline to AFSIW Launcher Embedded in Multi-Layer PCBsIEEE Microwave and Wireless Technology Letters · 2023
16. Fatigue life assessment of metal foils in multifunctional composites via combined experiments and simulationsComposites Part B Engineering · 2023
17. Inverse parameter determination for metal foils in multifunctional compositesMaterials & Design · 2023
18. A PCB-Embedded 1.2 kV SiC MOSFET Package With Reduced Manufacturing ComplexityIEEE Open Journal of Power Electronics · 2023
19. Detection of Printed Circuit Board Defects on ENIG and ENIPIG Surface Finishes with Convolutional Neural Networks and Evaluation of Training ParametersJournal of Microelectronics and Electronic Packaging · 2022
20. Compact X -Band Filter Based on Substrate Integrated Coaxial Line Stubs Using Advanced Multilayer PCB TechnologyIEEE Transactions on Microwave Theory and Techniques · 2016