The pursuit of smaller, lighter, and more efficient electronic devices in the electronics industry necessitates advanced packaging solutions. This study investigates the nuanced aspects of microvia technologies. Focusing on the impact of geometrical design parameters on the thermomechanical performance of microvias, Finite Element Method (FEM) simulations provide insights for various combinations of the geometrical variations.The research underscores the critical role of lower microvia wall angles experience failures, corroborating literature predictions. Stress distribution analyses in global and submodel configurations offer consistent trends, emphasizing the importance of meticulous microvia design considerations. The observed strain values and localized failure regions further highlight the need for precision in design to mitigate vulnerabilities. This study contributes essential knowledge to ongoing efforts in advancing microelectronic reliability, sustainability, and innovation, setting the stage for further scientific increment in microelectronic industry.
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Kamble et al. (2024) studied this question.
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