Applications and challenges of digital image correlation in the microscopic environment

The rapid development of novel materials and advanced devices, characterized by ultra-miniaturization and high-density integration, has underscored the significance of digital image correlation (DIC) techniques in multi-scale microscopy applications. This review offers a comprehensive assessment of DIC implementation across three principal microscopy platforms: optical microscopy, scanning microscopy, and transmission microscopy. The investigation focuses on several critical dimensions: (1) imaging modalities and their respective resolution capabilities, (2) advanced methodologies for speckle pattern preparation, and (3) practical applications in materials science and device characterization. Furthermore, this study critically evaluates the current technical limitations of DIC implementation across various length scales, proposing innovative solutions and offering strategic recommendations that substantially advance the development of microscopic deformation measurement techniques for DIC in emerging applications. Through a comprehensive analysis, the review establishes the boundaries of applicability and fundamental constraints for DIC-based deformation measurement techniques across various microscopy platforms. It provides researchers with essential guidelines and standardized frameworks for implementing DIC-based deformation analysis in diverse microscopic environments, thereby enabling more accurate and reliable strain characterization in advanced materials and devices.