Phase-field data fusion model for intermetallic compound growth at the SnAgCu/Cu interface under gradient temperature fields

With the continuous advancement of electronic packaging technology, accurately studying the growth mechanisms of intermetallic compounds (IMCs) at the SnAgCu/Cu interface under gradient temperature fields has become a critical issue. This paper proposes a multi-scale model that integrates phase-field modeling (Phase-Field Modeling) with multi-source data fusion technology (Data Fusion) to address this challenge. The model describes the diffusion-reaction kinetics of IMCs using phase-field variables and introduces a data fusion algorithm to optimize the influence of temperature gradients on interfacial energy and diffusion coefficients. By comparing experimental data with simulation results, the model’s effectiveness in predicting IMC layer thickness, morphological evolution, and thermomechanical reliability is validated.