Abstract Channeling ion implantation has attracted attention in the fabrication of 4H-SiC devices because of the capability of deep ion implantation with relatively low acceleration energy. In the case of the channeling to the crystal axes 〈0001〉 of 4H-SiC, there are two directions: 0001 and 000-1. In this work, we performed channeling Al ion implantation to the 0001 and 000-1 directions in 4H-SiC by implantation to the Si- or C-faces. The results show that the number of channeled ions to the 000-1 direction is larger compared to the case for implantation to the 0001 direction. Therefore, when we employ channeling Al ion implantation for 4H-SiC device fabrication, utilization of the Si-face is preferable.
Masashi Kato (Fri,) studied this question.