Floquet‐Engineered Noise‐Resilient Terahertz Receiver with Modular Phased Array Architecture for Scalable Chip‐Scale Communication

The transition to multichip and accelerator‐rich computing architectures has exposed the limitations of conventional wired interconnects, including bandwidth constraints, latency, and power inefficiencies. While wireless interconnects provide a scalable alternative, existing transceiver technologies often lack the interference resilience required for efficient multichip communication. To address these challenges, a terahertz (THz) modular phased array (MPA) transmitter and a 2D semiconductor quantum well (2DSQW)‐based nanoreceiver are introduced, enabling noise‐resilient signal demodulation without bulky processing hardware. The dual‐carrier MPA model enhances beam focusing precision while suppressing grating lobes and mitigating polarization mismatch with the receiver. The receiver response is characterized using Floquet engineering, leveraging the quantum behavior of charge carriers in time‐periodic radiation fields to achieve accurate polarization‐dependent response tuning. The 2DSQW‐based receiver's unique geometric design facilitates spatial modulation, ensuring robust noise suppression and interference detection. This architecture is particularly well‐suited for vertical communication in multichip quantum processors, where high wiring density and thermal constraints hinder scalability. By operating the MPA transmitter at elevated temperatures while maintaining the receiver at lower temperatures, effective thermal isolation is achieved. The proposed THz dual‐carrier MPA and 2DSQW‐based receiver provide a high‐bandwidth, low‐power solution for scalable wireless multichip communication in both classical and quantum computing systems.