The Separation Effect of Heat Treatment on Chili Seeds Based on Seed Viability

To improve the separation efficiency of chili seeds, heat treatment on the adhesion between the seeds, peel, and embryo seat was studied. This study was conducted to explore the separation effect of heat treatment on chili seeds based on different temperature conditions. Firstly, the physical properties and thermal properties parameters of the materials (chili seed, peel, and embryo seats) were measured. These physical data were imported into ANSYS 2022 software to carry out a thermal steady-state simulation experiment. And the effects on seed activity were studied with different temperature conditions. The results indicated that it can effectively reduce the adhesion force between seeds, fruit peels, and embryo seats at 120 °C for 60 s. The maximum thermal stresses of the chili peel, seed, and embryo seat were 3.687 MPa, 0.878 MPa, and 0.662 MPa, respectively. At the same time, the germination rate of seeds under this treatment condition remained above 80%, ensuring the high activity of the seeds. This study provided a theoretical basis for the separation technology of chili seeds, and it was expected to bring practical guidance for the efficient utilization and extraction of chili seeds.