Loop Thermosiphon for Efficient Cooling of Miniature Heat Sources in Electronics

The article considers a pulsating loop thermosyphon as the most promising heat-transfer device for coo­ ling heat-loaded miniature semiconductors, which has minimal evaporator dimensions and demonstrates a heat removal density of more than 120 W/cm2. The main disadvantage of this type of thermosyphons is high thermal resistance. To improve the efficiency of heat transfer, ultra-thin powder capillary structures were studied, which intensify the evaporation process in the evaporator of the loop thermosyphon. It has been shown that the use of a 140 μm thick powder capillary structure made from a fraction of copper powder PMS-N with particle sizes of 63–100 μm to reduces the thermal resistance of a loop thermosyphon by three times and increases the heat flux density to 220 W/cm2. The pulsating loop thermosyphon can be used in efficient cooling systems for server stations, industrial computers, telecommunication equipment, where it is necessary to remove heat from miniature semiconductor components in a limited space of a dense arrangement.