Three-dimensional model demonstrates optimal thermal profiles for ball terminals, suggesting effective eddy current concentrators for integrated circuits.
A three-dimensional nonlinear mathematical model of induction heating for forming ball terminals using the Flip-Chip technology has been developed. The study was conducted at frequencies of 300, 732, and 900 kHz with a heating power of 20–100 W. The use of a ferrite core focusing the magnetic field and an eddy current concentrator allowed us to establish optimal thermal profiles for forming ball terminals for mounting integrated circuits with a heating rate of 2.0 to 5.5 °C/s. When analyzing the results obtained from the experiments, the option of locating the concentrator at the bottom of the board turned out to be optimal. In this case, heating the solder balls at the selected frequencies reached the melting temperature of the ball terminals of 230–250 °C, which is sufficient for their reflow.
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Khatskevich et al. (2025) studied this question.
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