Multiphysics Finite Element Analysis of Wire and Ribbon Bonds Under Pulse Power Loads

Pulse power systems and devices represent a specialised area within electrical engineering. These systems are commonly employed in applications requiring substantial energy delivery over a short duration. Operating semiconductor devices under such conditions presents distinct challenges regarding their reliability, as they must endure high instantaneous power levels albeit at low duty cycles of less than 1%. Multiphysics finite element analysis (FEA) has previously been utilised to evaluate packing reliability under standard thermal and cycling power loads. This paper aims to employ FEA to assess the mechanical stress on the wire bond–die interface resulting from the high peak currents specific to these applications. The results and analysis show that pulse power applications apply additional stresses to the wire–bond die interface that have a significant effect on device reliability. A comparison between wire bond and ribbon bond interconnections was completed, showing how this additional stress can be reduced, allowing for more robust devices for pulse power applications.