Observational analysis indicates positive correlation between resistance and temperature in thermistors, highlighting material compatibility.
In this work we investigate the integration possibility of a thermistor paste from ESL (ElectroScience Laboratory, now Vibrantz) to see if it is adapted for Vibrantz Low Temperature Cofired Ceramics (LTCC) L8 and A6M-E materials. An alumina-based sample is used as a reference circuit throughout this study. Square, two-squares-in-parallel and two-squares-in-series thermistors are tested, placed internally and externally. Resistive values are measured in a range from 25 °C to 300 °C. The variation in the resistive values among similar thermistors is significant, with a maximum standard deviation of 67%. However, in all cases, there is a positive linear relationship between resistance and temperature. The Temperature Coefficient of Resistance (TCR) value is calculated before and after annealing. In general, the L8 and Al2O3 samples exhibit higher TCR values than the A6M-E sample. Additionally, when placed internally, the TCR value decreases approximately 30% for both tested LTCC materials. An Energy-Dispersive X-ray Spectroscopy (EDX) material analysis has also been conducted on the samples, revealing that the main chemical components are oxide, silicon, calcium, and ruthenium but also some barium and titanium, which indicates SiO2, TiO2, BaTiO3 and RuO2 oxides in the thermistor paste. The possibility to implement thermistors internally and externally on Vibrantz LTCC without delamination problems is endorsed by this study.
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Kärnfelt et al. (2025) studied this question.
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