This research demonstrates improved thermal stability and dielectric properties in epoxy resin, suggesting its suitability for high-temperature environments.
This study successfully improved the heat resistance of epoxy resin by optimizing the ratio of bisphenol A-type epoxy resin matrix and methyl tetrahydrophthalic anhydride curing agent, and using modified imidazole accelerator instead of amine curing agent. Infrared spectroscopy (FTIR) and thermogravimetric (TG) analysis have confirmed that high heat-resistant epoxy resin has higher thermal stability, and its thermal decomposition initiation temperature is significantly increased, making it suitable for high-temperature operating environments. In addition, high heat-resistant epoxy resin exhibits significant optimization in dielectric properties, with reduced dielectric constant, dielectric loss, and conductivity at high temperatures, demonstrating dielectric properties more suitable for high-temperature operating environments. By using the Kramers Kronig relationship, the dielectric relaxation characteristics of high heat-resistant epoxy resin were further revealed.
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Du et al. (2025) studied this question.
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