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September 18, 2025Journal of Applied Polymer Science0 citations

Enhanced Low-Dielectric SiO2/Polyimide Composite for High-Frequency Applications

Low‐Dielectric SiO2/Polyimide Prepreg Composite With Enhanced Interfacial, Thermal, and High‐Frequency Properties

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Authors

SKSeong-Hoon KangMSMinah SeoJJJeong‐Min Jo

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Overview

This composite shows improved thermal and interfacial properties for high-frequency electronics, indicating its potential in RF packaging.

Key Points

  • The SiO2-filled composite achieved a 30%–35% reduction in thermal expansion coefficient compared to the unfilled version.
  • Dielectric measurements showed a significantly improved dielectric constant of 2.1, highlighting its suitability for high-frequency applications.
  • S-parameter analysis confirmed reduced signal loss with a return loss below −35 dB and insertion loss near −2.0 dB.
  • Interfacial adhesion was enhanced by over 30% due to silane-induced chemical bonding, showing the effectiveness of the composite design.
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Cite This Study

Kang et al. (2025) studied this question.

synapsesocial.com/papers/68d461d231b076d99fa6174ehttps://doi.org/10.1002/app.57918
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